巴慕达电水壶维修网点微电子封装

　　With the rapid development of the microelectronics industry，Microelectronics package technology is 巴慕达台灯不工作 also constantly developing and progress。

　　1、miniaturization

　　Microelectronics packaging technology develops towards ultra-smallization，Ultra-small encapsulation form with the size of the chip size，Wafer grade package technology（WLP）。And low cost、high quality、Short delivery period、The dimensions of the shape meet international standards are required for miniaturization。

　　2、Adapt to high fever

　　Because the thermal resistance of the microelectronic package will increase due to the reduction in size，Electronic machine use environment complex，Therefore, the heat dissipation of the package must be solved.。Especially under high temperature conditions，The stability and reliability of long-term work must be guaranteed。

　　3、High-intensity

　　Since the integration of components is getting higher and higher，The number of pins that require microelectronics packages are more and more，The spacing between the pins is getting smaller.。

　　4、Adapt to multi-pin

　　More and more external leads are a major feature of microelectronics packages，Of course, it is also difficult，Because the pin spacing is unlimited，Delivery solder is difficult to stabilize，Very high failure rate。Multi-pin packaging is the mainstream of the future，Therefore, in the technical requirements of the microelectronic package, we should try to adapt to multi-pin.。