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          巴慕达电水壶维修网点微电子封装

          作者:巴慕达维修 发布时间:2022-01-26 00:01:01点击:
          今天给大家分享一下巴慕达电水壶维修网点微电子封装,大家都知道BALMUDA巴慕达是家庭中必不可少的高端大气的电器,那么BALMUDA巴慕达的知识以及相关资讯大家知道吗,下面就给大家分享一下巴慕达电水壶维修网点微电子封装。
          巴慕达电水壶维修网点微电子封装

            With the rapid development of the microelectronics industry,Microelectronics package technology is 巴慕达台灯不工作 also constantly developing and progress。

            1、miniaturization

            Microelectronics packaging technology develops towards ultra-smallization,Ultra-small encapsulation form with the size of the chip size,Wafer grade package technology(WLP)。And low cost、high quality、Short delivery period、The dimensions of the shape meet international standards are required for miniaturization。

            2、Adapt to high fever

            Because the thermal resistance of the microelectronic package will increase due to the reduction in size,Electronic machine use environment complex,Therefore, the heat dissipation of the package must be solved.。Especially under high temperature conditions,The stability and reliability of long-term work must be guaranteed。

            3、High-intensity

            Since the integration of components is getting higher and higher,The number of pins that require microelectronics packages are more and more,The spacing between the pins is getting smaller.。

            4、Adapt to multi-pin

            More and more external leads are a major feature of microelectronics packages,Of course, it is also difficult,Because the pin spacing is unlimited,Delivery solder is difficult to stabilize,Very high failure rate。Multi-pin packaging is the mainstream of the future,Therefore, in the technical requirements of the microelectronic package, we should try to adapt to multi-pin.。

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                    以上就是巴慕达电水壶维修网点微电子封装了,更多BALMUDA巴慕达电器资讯尽在日本BALMUDA_巴慕达维修电话_BALMUDA售后服务。

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